Invention Grant
- Patent Title: Stretchable circuit substrate and article
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Application No.: US16761155Application Date: 2018-10-12
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Publication No.: US10959326B2Publication Date: 2021-03-23
- Inventor: Naoko Okimoto , Kenichi Ogawa
- Applicant: DAI NIPPON PRINTING CO., LTD.
- Applicant Address: JP Tokyo-to
- Assignee: DAI NIPPON PRINTING CO., LTD.
- Current Assignee: DAI NIPPON PRINTING CO., LTD.
- Current Assignee Address: JP Tokyo-to
- Agency: Oliff PLC
- Priority: JPJP2017-215039 20171107
- International Application: PCT/JP2018/038090 WO 20181012
- International Announcement: WO2019/093069 WO 20190516
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K1/11 ; H05K3/46

Abstract:
A stretchable circuit substrate includes: a base material being stretchable; a wiring which is on a first surface side of the base material, and which includes a bellows-like member including a plurality of ridges and recesses arranged in a first direction which is one of in-plane directions in the first surface of the base material; and an adjustment layer which includes the bellows-like member and is on the first surface side of the base material so as to at least overlap, in a plan view, a wiring region in which the wiring is positioned; wherein the adjustment layer has a Young's modulus smaller than a Young's modulus of the wiring.
Public/Granted literature
- US20200267835A1 STRETCHABLE CIRCUIT SUBSTRATE AND ARTICLE Public/Granted day:2020-08-20
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