Invention Grant
- Patent Title: Apparatus for testing semiconductor packages
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Application No.: US16575805Application Date: 2019-09-19
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Publication No.: US10962581B2Publication Date: 2021-03-30
- Inventor: Ji Nyeong Yun , Jae Moo Choi , Jong Pill Park , Jae Hong Kim
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Muir Patent Law, PLLC
- Priority: KR10-2016-0092482 20160721
- Main IPC: G01R31/01
- IPC: G01R31/01 ; G01R31/28 ; G01R1/073 ; G01R31/319

Abstract:
A semiconductor integrated circuit test system can include a first semiconductor integrated circuit tester configured to conduct a first test of a first characteristic of one of a plurality of semiconductor integrated circuits, wherein the first test is completed by the first semiconductor integrated circuit tester within a first test time. A second semiconductor integrated circuit tester, can be coupled to the first semiconductor integrated circuit tester, where the second semiconductor integrated circuit tester can be configured to conduct a second test of a second characteristic of each of the plurality of the semiconductor integrated circuits simultaneously, wherein the second test is completed within a second test time that is at least about two orders of magnitude more than the first test time.
Public/Granted literature
- US20200011915A1 APPARATUS FOR TESTING SEMICONDUCTOR PACKAGES Public/Granted day:2020-01-09
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