Invention Grant
- Patent Title: Method and apparatus for high throughput photomask curing
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Application No.: US16685164Application Date: 2019-11-15
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Publication No.: US10962889B2Publication Date: 2021-03-30
- Inventor: Banqiu Wu , Eli Dagan , Khalid Makhamreh , Bruce J. Fender
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Patterson + Sheridan LLP
- Main IPC: G06F7/20
- IPC: G06F7/20 ; G03F1/66 ; G03F7/20 ; G03F1/22

Abstract:
Embodiments of the present disclosure generally relate to methods and apparatus for preparing a photomask for a lithography process. In one embodiment, a curing chamber is disclosed that includes an elevator adapted to receive a plurality of holder units. Each of the holder units comprise a holder, a clamp holding a photomask, one or more studs coupled to the photomask by an adhesive, and a spring coupled to each of the one or more studs.
Public/Granted literature
- US20200166834A1 METHOD AND APPARATUS FOR HIGH THROUGHPUT PHOTOMASK CURING Public/Granted day:2020-05-28
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