Invention Grant
- Patent Title: Method and apparatus for surface planarization of object using light source of specific wavelength and reactive gas
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Application No.: US16270594Application Date: 2019-02-08
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Publication No.: US10964550B2Publication Date: 2021-03-30
- Inventor: Gumin Kang , Il Ki Han , S. Joon Kwon , Young-Hwan Kim , Hyungduk Ko , Chun Keun Kim
- Applicant: KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY
- Applicant Address: KR Seoul
- Assignee: KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY
- Current Assignee: KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY
- Current Assignee Address: KR Seoul
- Agency: Cantor Colburn LLP
- Priority: KR10-2018-0047899 20180425
- Main IPC: H01L21/321
- IPC: H01L21/321 ; H01L21/66 ; H01L21/3105 ; H01L21/306
Abstract:
A method for surface planarization of an object using a light source of a specific wavelength according to an embodiment includes: providing an object in a main chamber; injecting an etching gas into the main chamber; inputting the light source of a specific wavelength onto a surface of the object; and controlling a temperature of the object. According to the method, it is possible to minimize the side effects such as scratches or contamination of the sample that occur in a conventional chemical-mechanical planarization process. In addition, it is possible to allow precise planarization in nanometers (nm) and simultaneously perform planarization to a side surface of a device as well as a large-sized surface, thereby reducing cost and time required for the planarization process. Moreover, since the surface roughness and the electrical conductivity are improved, it is possible to increase the efficiency and output of the LED device.
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