Invention Grant
- Patent Title: Integrated circuit controlled ejection system (ICCES) for massively parallel integrated circuit assembly (MPICA)
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Application No.: US16142448Application Date: 2018-09-26
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Publication No.: US10964561B2Publication Date: 2021-03-30
- Inventor: Michael R. Arneson , William R. Bandy
- Applicant: Matrics2, Inc.
- Applicant Address: US MN Warba
- Assignee: Matrics2, Inc.
- Current Assignee: Matrics2, Inc.
- Current Assignee Address: US MN Warba
- Agency: Fiala & Weaver P.L.L.C.
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L21/67 ; H01L23/00 ; H01L21/683 ; H01L23/544
Abstract:
Methods, systems, and apparatuses are described for integrated circuit controlled ejection system (ICCES) for massively parallel integrated circuit assembly (MPICA). A unique Integrated Circuit (IC) die ejection head assembly system is described, which utilizes Three-Dimensional (3D) printing to achieve very high resolution manufacturing to meet the precision tolerances required for very small IC die sizes.
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