Invention Grant
- Patent Title: Processing apparatus
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Application No.: US15725443Application Date: 2017-10-05
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Publication No.: US10964567B2Publication Date: 2021-03-30
- Inventor: Kazuma Sekiya
- Applicant: DISCO CORPORATION
- Applicant Address: JP Tokyo
- Assignee: DISCO CORPORATION
- Current Assignee: DISCO CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Greer Burns & Crain, Ltd.
- Priority: JPJP2016-198614 20161007
- Main IPC: H01L21/677
- IPC: H01L21/677 ; H01L21/67 ; H01L21/68 ; H01L21/66

Abstract:
Disclosed herein is a processing apparatus including a wafer testing unit for testing whether or not a wafer carried from a cassette mount unit is a wafer corresponding to a processing condition. The wafer testing unit measures characteristics of the carried wafer by a measuring section, and a determining section of a control unit compares actual measurements of the wafer characteristics measured by the measuring section with setpoints of wafer characteristics corresponding to the processing condition, to thereby determine conformability of the carried wafer. When it is determined by the determining section that the carried wafer is a wafer corresponding to the processing condition, the wafer is carried to a processing unit and processed. When it is determined by the determining section that the carried wafer is not a wafer corresponding to the processing condition, an error is notified by a notifying section.
Public/Granted literature
- US20180102268A1 PROCESSING APPARATUS Public/Granted day:2018-04-12
Information query
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