Invention Grant
- Patent Title: Film forming system, film forming method, and computer storage medium
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Application No.: US16481136Application Date: 2018-01-04
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Publication No.: US10964606B2Publication Date: 2021-03-30
- Inventor: Satoru Shimura , Masashi Enomoto
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Posz Law Group, PLC
- Priority: JPJP2017-020253 20170207
- International Application: PCT/JP2018/000031 WO 20180104
- International Announcement: WO2018/146981 WO 20180816
- Main IPC: H01L21/66
- IPC: H01L21/66 ; G03F7/16 ; H01L21/02 ; H01L21/027
Abstract:
A film forming system is to form an organic film on a substrate having a pattern formed on a surface thereof, includes: an organic film formation section configured to perform an organic film formation treatment on the substrate to form the organic film on the substrate; a film thickness measurement section configured to measure a film thickness of the organic film on the substrate; and an ultraviolet treatment section configured to perform an ultraviolet irradiation treatment on the organic film on the substrate to remove a surface of the organic film. In the film forming system, the organic film formation section, the film thickness measurement section, and the ultraviolet treatment section are disposed side by side in this order along a transfer direction of the substrate.
Public/Granted literature
- US20190355573A1 FILM FORMING SYSTEM, FILM FORMING METHOD, AND COMPUTER STORAGE MEDIUM Public/Granted day:2019-11-21
Information query
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