Invention Grant
- Patent Title: Power electronic metal-ceramic module and printed circuit board module with integrated power electronic metal-ceramic module and process for their making
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Application No.: US16415480Application Date: 2019-05-17
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Publication No.: US10964635B2Publication Date: 2021-03-30
- Inventor: Thomas Gottwald , Christian Rössle
- Applicant: Schweizer Electronic AG
- Applicant Address: DE Schramberg
- Assignee: Schweizer Electronic AG
- Current Assignee: Schweizer Electronic AG
- Current Assignee Address: DE Schramberg
- Agency: Shlesinger, Arkwright & Garvey LLP
- Priority: DE102018207955.2 20180522
- Main IPC: H05K1/18
- IPC: H05K1/18 ; H01L23/498 ; H01L21/48 ; H01L23/00 ; H01L21/56 ; H01L23/15 ; H01L23/13 ; H01L23/049
Abstract:
A power-electronic metal-ceramic module (10) comprising a metal-ceramic substrate (12) made of a ceramic carrier (14) having a metal top and bottom ply (16, 18), which is joined on or in the metal top ply (16) and/or the metal bottom ply (18) with a metal layer (16, 18, 22, 23) forming a frame (24) for accommodating at least one electronic component (30) and at least one electronic component (30) accommodated in the frame (24).
Information query
