Transistor packages in space-constrained applications are disclosed. An apparatus may comprise a first transistor package and a second transistor package, wherein the first transistor package is stacked upon the second transistor package. The apparatus may further comprise a cover coupled to a printed circuit board (PCB) that is configured to cover at least a portion of the stacked first and second transistor packages. The first and second transistor package may be components in a power circuit that is configured to down-convert a received voltage from a first voltage level to a second, lower voltage level.