Invention Grant
- Patent Title: Solid-state image pickup element and manufacturing method thereof, and electronic device
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Application No.: US16462683Application Date: 2017-11-17
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Publication No.: US10964754B2Publication Date: 2021-03-30
- Inventor: Masahiro Joei , Kenichi Murata
- Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Applicant Address: JP Kanagawa
- Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Current Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Current Assignee Address: JP Kanagawa
- Agency: Chip Law Group
- Priority: JPJP2016-235133 20161202
- International Application: PCT/JP2017/041419 WO 20171117
- International Announcement: WO2018/101078 WO 20180607
- Main IPC: H01L31/00
- IPC: H01L31/00 ; H01L27/30 ; H01L51/44

Abstract:
The present disclosure relates to a solid-state image pickup element in order to enable inhibition of a variation in the photoelectric conversion characteristic of an organic photoelectric conversion film due to atmospheric exposure and a manufacturing method of the solid-state image pickup element, and an electronic device. The solid-state image pickup element includes: a photoelectric conversion film formed above a semiconductor substrate; and a sidewall sealing a side face of the photoelectric conversion film. The sidewall includes a re-deposited film of a film directly under the sidewall. The present disclosure is applicable to, for example, a CMOS image sensor or the like.
Public/Granted literature
- US20200083297A1 SOLID-STATE IMAGE PICKUP ELEMENT AND MANUFACTURING METHOD THEREOF, AND ELECTRONIC DEVICE Public/Granted day:2020-03-12
Information query
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