Invention Grant
- Patent Title: Semiconductor device
-
Application No.: US16458454Application Date: 2019-07-01
-
Publication No.: US10964783B2Publication Date: 2021-03-30
- Inventor: Dae Hwan Chun
- Applicant: Hyundai Motor Company , Kia Motors Corporation
- Applicant Address: KR Seoul; KR Seoul
- Assignee: Hyundai Motor Company,Kia Motors Corporation
- Current Assignee: Hyundai Motor Company,Kia Motors Corporation
- Current Assignee Address: KR Seoul; KR Seoul
- Agency: Slater Matsil, LLP
- Priority: KR10-2018-0157503 20181207
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L29/78 ; H01L29/10 ; H01L29/16

Abstract:
A semiconductor device according to an exemplary embodiment of the present disclosure includes a substrate, an n− type layer, a plurality of trenches, a p type region, a p+ type region, an n+ type region, a gate electrode, a source electrode, and a drain electrode. The semiconductor device may include a plurality of unit cells. A unit cell among the plurality of unit cells may include a contact portion with which the source electrode and the n+ type region are in contact, a first branch part disposed above the contact portion on a plane, and a second branch part disposed below the contact portion on a plane, the plurality of trenches are separated from each other and disposed with a stripe shape on a plane.
Public/Granted literature
- US20200185496A1 Semiconductor Device Public/Granted day:2020-06-11
Information query
IPC分类: