Invention Grant
- Patent Title: Technologies for long-lived 3D multimode microwave cavities
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Application No.: US16352191Application Date: 2019-03-13
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Publication No.: US10964997B2Publication Date: 2021-03-30
- Inventor: David Schuster , Ravi Naik , Srivatsan Chakram
- Applicant: The University of Chicago
- Applicant Address: US IL Chicago
- Assignee: The University of Chicago
- Current Assignee: The University of Chicago
- Current Assignee Address: US IL Chicago
- Agency: Barnes & Thornburg LLP
- Main IPC: H01P7/06
- IPC: H01P7/06 ; H01P1/30 ; H01P1/16 ; G06N10/00

Abstract:
Technologies for a long-lived 3D multimode microwave cavity are disclosed. In the illustrative embodiment, a series of overlapping holes are drilled into a monolithic block of aluminum forming a cavity. The dimensions of the cavity formed by the overlapping holes can be made long by drilling a long series of holes in a row and can be made high by drilling holes a certain depth into the cavity. If two dimensions of the cavity are bigger than the diameter of the holes used to create the cavity, then the cavity can support electromagnetic waves that cannot propagate through the holes, leading to a long lifetime in the cavity. A superconducting qubit or other non-linear element can be inserted into the cavity, which can controllably interact with each of several modes of the cavity. In this way, the modes of the cavity can act as components in a quantum memory.
Public/Granted literature
- US20190288367A1 TECHNOLOGIES FOR LONG-LIVED 3D MULTIMODE MICROWAVE CAVITIES Public/Granted day:2019-09-19
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