Invention Grant
- Patent Title: Short link efficient interconnect circuitry
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Application No.: US16736436Application Date: 2020-01-07
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Publication No.: US10965501B2Publication Date: 2021-03-30
- Inventor: Hsinho Wu , Masashi Shimanouchi , Peng Li
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Fletcher Yoder P.C.
- Main IPC: H03H21/00
- IPC: H03H21/00 ; H04L25/03 ; H04L25/14 ; G06N20/00

Abstract:
Systems and methods for electronic devices including two or more semiconductor devices coupled via an interconnect. The interconnect includes multiple lanes each having a link between the first and second semiconductor devices. One or more lanes of the multiple lanes each include clock and data recovery circuitry to perform full clock and data recovery. One or more other lanes of the multiple lanes each do not include clock and data recovery circuitry and instead includes a phase adjustment and clock multiplier circuit that is slave to clock and data recovery circuitry of the one or more lanes.
Information query