Invention Grant
- Patent Title: Forming device
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Application No.: US15717692Application Date: 2017-09-27
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Publication No.: US10967413B2Publication Date: 2021-04-06
- Inventor: Masayuki Saika , Masayuki Ishizuka , Norieda Ueno
- Applicant: SUMITOMO HEAVY INDUSTRIES, LTD.
- Applicant Address: JP Tokyo
- Assignee: SUMITOMO HEAVY INDUSTRIES, LTD.
- Current Assignee: SUMITOMO HEAVY INDUSTRIES, LTD.
- Current Assignee Address: JP Tokyo
- Agency: Michael Best & Friedrich LLP
- Priority: JPJP2015-070845 20150331
- Main IPC: B21D26/047
- IPC: B21D26/047 ; B21D37/16 ; B21D26/033

Abstract:
A forming device that forms a metal pipe by heating and expanding a metal pipe material includes: a pair of an upper die and a lower die between which the metal pipe material is heated and expanded; upper electrodes and lower electrodes that sandwich both end parts of the metal pipe material therebetween from upper and lower sides to heat the metal pipe material; and a busbar that is connected only to either the upper electrodes or the lower electrodes to supply electric power from a power supply.
Public/Granted literature
- US20180015519A1 FORMING DEVICE Public/Granted day:2018-01-18
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