Invention Grant
- Patent Title: Forming device
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Application No.: US15887643Application Date: 2018-02-02
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Publication No.: US10967414B2Publication Date: 2021-04-06
- Inventor: Masayuki Saika , Masayuki Ishizuka , Norieda Ueno , Shuji Miyazaki , Koji Moritani , Taizo Yamamoto
- Applicant: SUMITOMO HEAVY INDUSTRIES, LTD.
- Applicant Address: JP Tokyo
- Assignee: SUMITOMO HEAVY INDUSTRIES, LTD.
- Current Assignee: SUMITOMO HEAVY INDUSTRIES, LTD.
- Current Assignee Address: JP Tokyo
- Agency: Michael Best & Friedrich LLP
- Priority: JPJP2015-169494 20150828
- Main IPC: B21D26/047
- IPC: B21D26/047 ; B21D26/033

Abstract:
A forming device that expands a metal pipe material to form a metal pipe includes a die that has an upper die and a lower die, at least one of which is movable, and that form the metal pipe, an electrode that energizes the metal pipe material to heat the metal pipe material, a gas supply part that supplies a gas into the heated metal pipe material to expand the metal pipe material, and a die movement suppressing part that suppresses the movement of the die by an electromagnetic force at least when the energization to the metal pipe material is performed by the electrode.
Public/Granted literature
- US20180221933A1 FORMING DEVICE Public/Granted day:2018-08-09
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