Invention Grant
- Patent Title: Coated copper particles and use thereof
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Application No.: US15754370Application Date: 2015-08-28
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Publication No.: US10967428B2Publication Date: 2021-04-06
- Inventor: Minfang Mu , Dan Feng , Jose M. Rodriguez-Parada
- Applicant: DUPONT ELECTRONICS, INC.
- Applicant Address: US DE Wilmington
- Assignee: DUPONT ELECTRONICS, INC.
- Current Assignee: DUPONT ELECTRONICS, INC.
- Current Assignee Address: US DE Wilmington
- International Application: PCT/CN2015/088444 WO 20150828
- International Announcement: WO2017/035709 WO 20170309
- Main IPC: B22F1/02
- IPC: B22F1/02 ; C09J9/02 ; C09J11/04 ; B22F1/00 ; C08K9/02 ; C08K3/22
Abstract:
Disclosed herein are coated copper particles formed of copper cores that are surface coated with a coating composition comprising one or more conductive oxides. Further disclosed herein are electrically conductive adhesives (ECA) comprising: (a) organic binder, (b) surface coated copper particles, and optional (c) solvent.
Public/Granted literature
- US20180250740A1 COATED COPPER PARTICLES AND USE THEREOF Public/Granted day:2018-09-06
Information query
