Invention Grant
- Patent Title: Metal wire, saw wire, cutting apparatus, and method of manufacturing metal wire
-
Application No.: US16256636Application Date: 2019-01-24
-
Publication No.: US10967447B2Publication Date: 2021-04-06
- Inventor: Tomohiro Kanazawa , Naoki Kohyama , Yoshihiro Iguchi , Yuuki Sasagawa , Tetsuji Shibata , Toshiyuki Tani
- Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Applicant Address: JP Osaka
- Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee Address: JP Osaka
- Agency: Greenblum & Bernstein, P.L.C.
- Priority: JPJP2018-012955 20180129
- Main IPC: B23D61/18
- IPC: B23D61/18 ; B23D65/00 ; B23D57/00 ; B28D5/04 ; C22C38/12 ; C22C27/04 ; B24B27/06 ; C25D15/02

Abstract:
A metal wire containing tungsten is provided. A tungsten content of the metal wire is at least 90 wt %. A tensile strength of the metal wire is at least 4000 MPa. An elastic modulus of the metal wire is at least 350 GPa and at most 450 GPa. A diameter of the metal wire is at most 60 μm. An average crystal grain size of the metal wire in a cross-section orthogonal to an axis of the metal wire is at most 0.20 μm.
Public/Granted literature
- US20190232404A1 METAL WIRE, SAW WIRE, CUTTING APPARATUS, AND METHOD OF MANUFACTURING METAL WIRE Public/Granted day:2019-08-01
Information query