Invention Grant
- Patent Title: CMP layer based on porous cerium oxide and preparation method thereof
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Application No.: US16186575Application Date: 2018-11-11
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Publication No.: US10967481B2Publication Date: 2021-04-06
- Inventor: Wentao Dan
- Applicant: Hubei Dinghui Microelectronics Materials Co., LTD
- Applicant Address: CN Wuhan
- Assignee: Hubei Dinghui Microelectronics Materials Co., LTD
- Current Assignee: Hubei Dinghui Microelectronics Materials Co., LTD
- Current Assignee Address: CN Wuhan
- Agency: Cooper Legal Group, LLC
- Priority: CN201810875213 20180803
- Main IPC: B24B37/24
- IPC: B24B37/24 ; B24B37/22 ; C09K3/14

Abstract:
The present invention relates to a technical field of CMP pad manufacture, and more particularly to a CMP layer based on porous cerium oxide and a preparation method thereof. The CMP layer of the present invention is formed by mixing and curing a polyurethane prepolymer, a crosslinking agent and the porous cerium oxide, including steps of preheating the polyurethane prepolymer under vacuum, then adding a porous cerium oxide filler to the polyurethane prepolymer, and thoroughly mixing to obtain a mixed prepolymer; moving the mixed prepolymer to a first tank, and performing heat preservation, stirring, and circulation treatments; adding the crosslinking agent to a second tank and performing a melting treatment; correcting an injection weight ratio of the first tank and the second tank, then rapidly mixing, so as to inject into the mold; and then curing and vulcanizing to obtain the polishing layer.
Public/Granted literature
- US20190076983A1 CMP layer based on porous cerium oxide and preparation method thereof Public/Granted day:2019-03-14
Information query