Invention Grant
- Patent Title: Laser-releasable bonding materials for 3-D IC applications
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Application No.: US16229591Application Date: 2018-12-21
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Publication No.: US10968348B2Publication Date: 2021-04-06
- Inventor: Xiao Liu , Qi Wu , Rama Puligadda , Dongshun Bai , Baron Huang
- Applicant: Brewer Science, Inc.
- Applicant Address: US MO Rolla
- Assignee: Brewer Science, Inc.
- Current Assignee: Brewer Science, Inc.
- Current Assignee Address: US MO Rolla
- Agency: Hovey Williams LLP
- Main IPC: C08L71/12
- IPC: C08L71/12 ; H01L23/00 ; H01L23/31 ; H01L23/528 ; H01L21/48 ; C08K3/00 ; H01L21/683
Abstract:
Novel thermoplastic polyhydroxyether-based compositions for use as a laser-releasable composition for temporary bonding and laser debonding processes are provided. The inventive compositions can be debonded using various UV lasers, leaving behind little to no debris. The layers formed from these compositions possess good thermal stabilities and are soluble in commonly-used organic solvents (e.g., cyclopentanone). The compositions can also be used as build-up layers for RDL formation.
Public/Granted literature
- US20190194453A1 LASER-RELEASABLE BONDING MATERIALS FOR 3-D IC APPLICATIONS Public/Granted day:2019-06-27
Information query
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