Invention Grant
- Patent Title: Epoxy adhesive composition
-
Application No.: US16334814Application Date: 2017-09-26
-
Publication No.: US10968373B2Publication Date: 2021-04-06
- Inventor: Shiori Tateno , Takayuki Maeda , Kenji Yamauchi
- Applicant: SEKISUI CHEMICAL CO., LTD.
- Applicant Address: JP Osaka
- Assignee: SEKISUI CHEMICAL CO., LTD.
- Current Assignee: SEKISUI CHEMICAL CO., LTD.
- Current Assignee Address: JP Osaka
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: JPJP2016-194177 20160930,JPJP2017-068920 20170330
- International Application: PCT/JP2017/034798 WO 20170926
- International Announcement: WO2018/062205 WO 20180405
- Main IPC: C09J163/00
- IPC: C09J163/00 ; C08L31/04 ; C08F8/28 ; C09J129/14

Abstract:
The present invention provides an epoxy adhesive composition that is excellent in compatibility and storage stability, has high strength and excellent adhesiveness, is capable of reducing occurrence of warping or peeling when used for bonding different materials, and is also excellent in impact resistance after being cured. Provided is an epoxy adhesive composition including: a modified polyvinyl acetal resin having a constitutional unit with an acid-modified group; and an epoxy resin, the epoxy adhesive composition containing an organic solvent in an amount of 10.0% by weight or less.
Public/Granted literature
- US20190276718A1 EPOXY ADHESIVE COMPOSITION Public/Granted day:2019-09-12
Information query