Invention Grant
- Patent Title: Chemical-mechanical processing slurry and methods for processing a nickel substrate surface
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Application No.: US15951598Application Date: 2018-04-12
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Publication No.: US10968377B2Publication Date: 2021-04-06
- Inventor: Tong Li , Hon Wu Lau
- Applicant: Cabot Microelectronics Corporation
- Applicant Address: US IL Aurora
- Assignee: Cabot Microelectronics Corporation
- Current Assignee: Cabot Microelectronics Corporation
- Current Assignee Address: US IL Aurora
- Agent Thomas Omholt; Erika R. Singleton
- Main IPC: C09K3/14
- IPC: C09K3/14 ; C09G1/02 ; C09G1/04 ; B24B37/04
Abstract:
Described are chemical mechanical processing (CMP) compositions and related methods, including compositions and methods for polishing nickel phosphorus (NiP) surfaces for hard disk applications.
Public/Granted literature
- US20180298257A1 CHEMICAL-MECHANICAL PROCESSING SLURRY AND METHODS FOR PROCESSING A NICKEL SUBSTRATE SURFACE Public/Granted day:2018-10-18
Information query
