Invention Grant
- Patent Title: Semiconductor integrated optical device, and method of fabricating semiconductor integrated optical device
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Application No.: US16831895Application Date: 2020-03-27
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Publication No.: US10969543B2Publication Date: 2021-04-06
- Inventor: Takuo Hiratani
- Applicant: SUMITOMO ELECTRIC INDUSTRIES, LTD.
- Applicant Address: JP Osaka
- Assignee: SUMITOMO ELECTRIC INDUSTRIES, LTD.
- Current Assignee: SUMITOMO ELECTRIC INDUSTRIES, LTD.
- Current Assignee Address: JP Osaka
- Agency: Oliff PLC
- Priority: JPJP2019-075578 20190411
- Main IPC: G02B6/12
- IPC: G02B6/12 ; G02B6/136 ; H01S5/00

Abstract:
A semiconductor integrated optical device includes a waveguide mesa having a first multilayer including a first core layer, a second multilayer including a second core layer, and a butt joint interface between the first core layer and the second core layer; a support having first to third regions; and a buried semiconductor region provided on the support. The first multilayer has a first mesa width on the first region. The second multilayer has a second mesa width on the second region. On the third region, the second multilayer has a waveguide portion having a third mesa width smaller than the first and the second mesa widths. The second core layer has a waveguide core thickness on the second region. In the waveguide portion, the second core layer has a core portion having a thickness different from the waveguide core thickness at a position away from the butt-joint interface.
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