Invention Grant
- Patent Title: Heat spreaders with interlocked inserts
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Application No.: US15768915Application Date: 2015-11-16
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Publication No.: US10969840B2Publication Date: 2021-04-06
- Inventor: Aravindha R. Antoniswamy , Syadwad Jain , Zhizhong Tang , Wei Hu
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Patent Capital Group
- International Application: PCT/US2015/060832 WO 20151116
- International Announcement: WO2017/086912 WO 20170526
- Main IPC: G06F1/20
- IPC: G06F1/20 ; H01L21/48 ; H01L23/40 ; H01L23/373 ; H01L23/367 ; H01L23/36

Abstract:
Disclosed herein are embodiments of heat spreaders with interlocked inserts, and related devices and methods. In some embodiments, a heat spreader may include: a frame formed of a first material, wherein the frame includes an opening, a projection of the frame extends into the opening, and the projection has a top surface, a side surface, and a bottom surface; a recess having at least one sidewall formed by the frame; and an insert formed of a second material different from the first material, wherein the insert is disposed in the frame and in contact with the top surface, the side surface, and the bottom surface of the projection.
Public/Granted literature
- US20190079567A1 HEAT SPREADERS WITH INTERLOCKED INSERTS Public/Granted day:2019-03-14
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