Invention Grant
- Patent Title: Storage system with interconnected solid state disks
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Application No.: US16585892Application Date: 2019-09-27
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Publication No.: US10970207B2Publication Date: 2021-04-06
- Inventor: Peng Li , Jawad B. Khan , Sanjeev N. Trika
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Compass IP Law PC
- Main IPC: G06F12/06
- IPC: G06F12/06 ; G11C7/10 ; G05B19/045
Abstract:
An embodiment of a semiconductor package apparatus may include technology to provide a first interface between a first storage device and a host device, and provide a second interface directly between the first storage device and a second storage device. Other embodiments are disclosed and claimed.
Public/Granted literature
- US20200097405A1 STORAGE SYSTEM WITH INTERCONNECTED SOLID STATE DISKS Public/Granted day:2020-03-26
Information query
