A damping device to isolate electronic equipment from its surrounding environment may including a housing comprised of a lower housing and an upper housing, a base pad attached to a bottom side of the lower housing, a suspension material in connection with to a top side of the lower housing, an absorptive material in connection with the suspension material, the upper housing surrounding the absorptive material, and a top pad attached to a top side of the absorptive material. The diameter of the suspension material may be smaller than the diameter of the absorptive material, which may be smaller than the diameter of the upper housing, forming spaces to isolate the absorptive material within the housing.