Invention Grant
- Patent Title: Multilayer electronic component
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Application No.: US15673120Application Date: 2017-08-09
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Publication No.: US10971303B2Publication Date: 2021-04-06
- Inventor: Young Su Jang , Won Sik Chong , Min Ha Hwang , Jun Boum Lim
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR10-2016-0144710 20161101
- Main IPC: H01G4/232
- IPC: H01G4/232 ; H01G4/012 ; H01G2/06 ; H01G4/12 ; H01G4/30

Abstract:
A multilayer electronic component includes first and second external electrodes disposed on one surface of the body, the first internal electrode and the first external electrode being connected by a first via disposed within the body, the second internal electrode and the second external electrode being connected by a second via disposed within the body, the first internal electrode including first and second through portions, and the second internal electrode including third and fourth through portions, the first via penetrating alternately through the first through portion and the third through portion, the second via penetrating alternately through the second through portion and the fourth through portion, and a lead portion of the first via being connected to one end portion of the first external electrode, and a lead portion of the second via being connected to one end portion of the second external electrode.
Public/Granted literature
- US20180122575A1 MULTILAYER ELECTRONIC COMPONENT Public/Granted day:2018-05-03
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