Invention Grant
- Patent Title: Method for dehydrating semiconductor structure and dehydrating method of the same
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Application No.: US16675934Application Date: 2019-11-06
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Publication No.: US10971353B2Publication Date: 2021-04-06
- Inventor: Chung-Chieh Lee
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Current Assignee Address: TW Hsinchu
- Agency: WPAT P.C., Intellectual Property Attorneys
- Agent Anthony King
- Main IPC: F26B5/06
- IPC: F26B5/06 ; H01L21/02 ; H01L21/3065 ; B08B3/10 ; H01L21/687
Abstract:
The present disclosure provides a method for dehydrating a semiconductor structure, including providing a semiconductive substrate, forming a trench on the semiconductive substrate, dispensing an agent in liquid form into the trench, solidifying the agent, and dehydrating a surface in the trench by transforming the agent from solid form to vapor form.
Public/Granted literature
- US20200090925A1 METHOD FOR DEHYDRATING SEMICONDUCTOR STRUCTURE AND DEHYDRATING METHOD OF THE SAME Public/Granted day:2020-03-19
Information query
IPC分类:
