Invention Grant
- Patent Title: Multi-chip structure and method of forming same
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Application No.: US16881898Application Date: 2020-05-22
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Publication No.: US10971371B2Publication Date: 2021-04-06
- Inventor: Chen-Hua Yu , Der-Chyang Yeh
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Slater Matsil, LLP
- Main IPC: H01L21/31
- IPC: H01L21/31 ; H01L21/3105 ; H01L25/00 ; H01L23/00 ; H01L23/31 ; H01L21/56 ; H01L25/065 ; H01L25/18 ; H01L21/683 ; H01L23/48 ; H01L23/498
Abstract:
A device includes a first chip is embedded in a molding compound layer, wherein the first chip is shifted toward a first direction, a second chip over the first chip and embedded in the molding compound layer, wherein the second chip is shifted toward a second direction opposite to the first direction and a plurality of bumps between the first chip and the second chip.
Public/Granted literature
- US20200286741A1 Multi-Chip Structure and Method of Forming Same Public/Granted day:2020-09-10
Information query
IPC分类:
