Invention Grant
- Patent Title: De-bonding leveling device and de-bonding method
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Application No.: US16321682Application Date: 2017-07-27
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Publication No.: US10971380B2Publication Date: 2021-04-06
- Inventor: Yuying Gao , Wei Wei
- Applicant: SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.
- Applicant Address: CN Shanghai
- Assignee: SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.
- Current Assignee: SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.
- Current Assignee Address: CN Shanghai
- Agency: Muncy, Geissler, Olds & Lowe, P.C.
- Priority: CN201610617042.9 20160729
- International Application: PCT/CN2017/094765 WO 20170727
- International Announcement: WO2018/019276 WO 20180201
- Main IPC: B32B43/00
- IPC: B32B43/00 ; H01L21/67 ; B32B38/10

Abstract:
A debonding leveling device and a debonding method are for leveling during a process for debonding a first object and a second object. The first and second objects are retained by a first fixation plate (11) and a second fixation plate (21), respectively. The device includes: a mounting plate (30), disposed at an outer side of one of the first (11) and second (21) fixation plates; a connecting rod assembly (40) fixed around a center position of the mounting plate (30), the connecting rod assembly (40) connected to the one of the first (11) and second (21) fixation plates sequentially via a sliding pair (50) and a spherical pair (60) connected to the sliding pair (50); and at least three elastic assemblies (70) disposed between the mounting plate and the one of the first and second fixation plates, each of the elastic assemblies coupled to the mounting plate (30) and the one of the first (11) and second (21) fixation plates. The combination of the spherical pair and the sliding pair allows an adaptation of leveling objects to dynamic changes of the reference, and the elastic assemblies performs a leveling for the leveling objects in real-time based on an orientation of the reference. This entails a simple structure with a reasonable layout, which is easy to use in practice and is particularly helping in dynamic leveling applications without requiring an active control.
Public/Granted literature
- US20200090961A1 DE-BONDING LEVELING DEVICE AND DE-BONDING METHOD Public/Granted day:2020-03-19
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