Invention Grant
- Patent Title: Transfer chambers with an increased number of sides, semiconductor device manufacturing processing tools, and processing methods
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Application No.: US15029502Application Date: 2014-11-03
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Publication No.: US10971381B2Publication Date: 2021-04-06
- Inventor: Michael Robert Rice , Michael Meyers , John J. Mazzocco , Dean C. Hruzek , Michael Kuchar , Sushant S. Koshti , Penchala N. Kankanala , Eric A. Englhardt
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Lowenstein Sandler LLP
- International Application: PCT/US2014/063708 WO 20141103
- International Announcement: WO2015/066624 WO 20150507
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01L21/677
Abstract:
A transfer chamber configured to be used during semiconductor device manufacturing is described. Transfer chamber includes at least one first side of a first width configured to couple to one or more substrate transfer units (e.g., one or more load locks or one or more pass-through units), and at least a second set of sides of a second width that is different than the first width, the second set of sides configured to couple to one or more processing chambers. A total number of sides of the transfer chamber is at least seven. Transfers within the transfer chamber are serviceable by a single robot. Process tools and methods for processing substrates are described, as are numerous other aspects.
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