Invention Grant
- Patent Title: Substrate processing apparatus and transfer position correcting method
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Application No.: US16655504Application Date: 2019-10-17
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Publication No.: US10971385B2Publication Date: 2021-04-06
- Inventor: Hiroki Oka , Hiroshi Narushima , Sho Otsuki , Takehiro Shindo
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Pearne & Gordon LLP
- Priority: JPJP2018-196683 20181018
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01L21/677 ; B65G47/91 ; H01L21/687 ; H01L21/683

Abstract:
A substrate processing apparatus includes a transfer device, having a first pick configured to hold the substrate, configured to transfer a substrate; a detecting device configured to detect a position of the substrate; a susceptor configured to place the substrate thereon; an elevating device configured to move the substrate up and down; and a control device. The control device comprises an adjuster configured to perform a teaching processing; a detector configured to deliver the substrate from the first pick to the susceptor and from the susceptor to the first pick, and configured to detect a first position of the substrate, which is delivered from the susceptor to the first pick, by the detecting device; and a corrector configured to correct the position of the first pick based on a deviation amount between the first position of the substrate and a reference position.
Information query
IPC分类: