Invention Grant
- Patent Title: Power module and power convertor
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Application No.: US16208620Application Date: 2018-12-04
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Publication No.: US10971424B2Publication Date: 2021-04-06
- Inventor: Kenta Nakahara , Yoshihiro Yamaguchi , Fumihito Kawahara
- Applicant: Mitsubishi Electric Corporation
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Electric Corporation
- Current Assignee: Mitsubishi Electric Corporation
- Current Assignee Address: JP Tokyo
- Agency: Studebaker & Brackett PC
- Priority: JP2018-021970 20180209
- Main IPC: H01L23/373
- IPC: H01L23/373 ; H01L23/367 ; H01L23/13 ; H01L23/00 ; H01L23/043 ; H01L23/24 ; H01L25/07
Abstract:
A power module includes a recessed base plate having a hollow portion, at least one insulating substrate disposed in the hollow portion of the base plate, at least one semiconductor chip mounted on the at least one insulating substrate, and sealing resin for sealing a surface of the hollow portion side of the base plate, the at least one insulating substrate, and the at least one semiconductor chip.
Public/Granted literature
- US10923410B2 Power module and power convertor Public/Granted day:2021-02-16
Information query
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