Invention Grant
- Patent Title: Interconnection structure including a metal post encapsulated by a joint material having concave outer surface
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Application No.: US15797623Application Date: 2017-10-30
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Publication No.: US10971463B2Publication Date: 2021-04-06
- Inventor: Chun-Lin Lu , Kai-Chiang Wu , Ming-Kai Liu , Yen-Ping Wang , Shih-Wei Liang , Ching-Feng Yang , Chia-Chun Miao , Hao-Yi Tsai
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Current Assignee Address: TW Hsinchu
- Agency: WPAT, P.C., Intellectual Property Attorneys
- Agent Anthony King
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L23/498

Abstract:
A semiconductor device includes a first carrier including a first pad, a second carrier including a second pad disposed opposite to the first pad, a joint coupled with and standing on the first pad, a joint encapsulating the post and bonding the first pad with the second pad, a first entire contact interface between the first pad and the joint, a second entire contact interface between the first pad and the post, and a third entire contact interface between the joint and the second pad. The first entire contact interface, the second entire contact interface and the third entire contact interface are flat surfaces. A distance between the first entire contact interface and the third entire contact interface is equal to a distance between the second entire contact interface and the third entire contact interface. The second entire contact interface is a continuous surface.
Public/Granted literature
- US20180061798A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF Public/Granted day:2018-03-01
Information query
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