A semiconductor package includes: a substrate; a first interposer disposed over the substrate; a first chip stack disposed on the substrate on one side of the first interposer, wherein the first chip stack includes a plurality of first semiconductor chips stacked with an offset in a first direction; a second chip stack disposed on the first chip stack, wherein the second chip stack includes a plurality of second semiconductor chips stacked with an offset in a second direction opposite to the first direction; and a third chip stack disposed on the substrate on an other side of the first interposer, wherein the third chip stack includes a plurality of third semiconductor chips stacked with an offset in the second direction.