Invention Grant
- Patent Title: Power semiconductor device
-
Application No.: US16444775Application Date: 2019-06-18
-
Publication No.: US10971591B2Publication Date: 2021-04-06
- Inventor: Dai Kitano
- Applicant: Mitsubishi Electric Corporation
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Electric Corporation
- Current Assignee: Mitsubishi Electric Corporation
- Current Assignee Address: JP Tokyo
- Agency: Studebaker & Brackett PC
- Priority: JPJP2018-155920 20180823
- Main IPC: H01L29/45
- IPC: H01L29/45 ; H01L29/739 ; H01L29/417 ; H01L29/06

Abstract:
Provided is a power semiconductor device that prevents element breakage, thus improving its reliability. The power semiconductor device includes a first main electrode. The first main electrode includes a first metal film, an intermediate film, and a second metal film. The first and second metal films are made of metal having an Al concentration greater than or equal to 95 wt %. The intermediate film contains primary-constituent phases each formed of a metal compound, and contains a secondary-constituent phase formed of an iron group element. The metal compound is that of at least one kind of element selected from a group consisting of a group 4A element, a group 5A element, and a group 6A element, and at least one kind of element selected from a group consisting of C and N. The intermediate film has a higher degree of hardness than the second metal film.
Public/Granted literature
- US20200066860A1 POWER SEMICONDUCTOR DEVICE Public/Granted day:2020-02-27
Information query
IPC分类: