Invention Grant
- Patent Title: Semiconductor device and manufacturing method thereof
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Application No.: US16729579Application Date: 2019-12-30
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Publication No.: US10971617B2Publication Date: 2021-04-06
- Inventor: Ronghui Hao
- Applicant: INNOSCIENCE (ZHUHAI) TECHNOLOGY CO., LTD.
- Applicant Address: CN Zhuhai
- Assignee: INNOSCIENCE (ZHUHAI) TECHNOLOGY CO., LTD.
- Current Assignee: INNOSCIENCE (ZHUHAI) TECHNOLOGY CO., LTD.
- Current Assignee Address: CN Zhuhai
- Agency: Idea Intellectual Limited
- Agent Margaret A. Burke; Sam T. Yip
- Priority: CN201910855069.5 20190910
- Main IPC: H01L29/778
- IPC: H01L29/778 ; H01L29/205 ; H01L29/20 ; H01L27/06 ; H01L27/092 ; H01L29/66

Abstract:
Some embodiments of this disclosure provide a semiconductor device. The semiconductor device includes: a substrate; a barrier layer, disposed on the substrate; a first channel layer, disposed on the barrier layer; a first gate conductor, disposed on the first channel layer; and a first doped semiconductor layer, disposed between the first gate conductor and the first channel layer, where a forbidden band width of the barrier layer is greater than a forbidden band width of the first channel layer.
Public/Granted literature
- US20210074837A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF Public/Granted day:2021-03-11
Information query
IPC分类: