- Patent Title: Light emitting diode package and method of manufacturing the same
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Application No.: US15145972Application Date: 2016-05-04
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Publication No.: US10971662B2Publication Date: 2021-04-06
- Inventor: Hyuk-jin Cho , Dong-hoon Lee
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR10-2015-0087586 20150619
- Main IPC: H01L33/50
- IPC: H01L33/50 ; H01L33/54 ; H01L33/48 ; H01L33/60
Abstract:
A light-emitting diode (LED) package includes a light-emitting structure, a transmissive material layer on the light-emitting structure, and a support structure covering at least a portion of a side surface of the transmissive material layer, a side surface of the light-emitting structure, and at least a portion of a bottom surface of the light-emitting structure.
Public/Granted literature
- US20160372642A1 LIGHT EMITTING DIODE PACKAGE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2016-12-22
Information query
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