Invention Grant
- Patent Title: Method for manufacturing an optical module and optical module
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Application No.: US16484189Application Date: 2018-02-28
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Publication No.: US10971666B2Publication Date: 2021-04-06
- Inventor: Makoto Kitazume , Tadashi Ono , Toshiki Komiyama , Yuki Inugai
- Applicant: MITSUMI ELECTRIC CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: MITSUMI ELECTRIC CO., LTD.
- Current Assignee: MITSUMI ELECTRIC CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: IPUSA, PLLC
- Priority: JPJP2017-049732 20170315
- International Application: PCT/JP2018/007574 WO 20180228
- International Announcement: WO2018/168473 WO 20180920
- Main IPC: H01L33/52
- IPC: H01L33/52 ; H01L33/60 ; H01L25/075 ; H01L33/50 ; H01L33/56 ; H01L33/62 ; H01L23/31 ; H01L33/46 ; H01L21/56

Abstract:
A method includes mounting a light emitting device on a board having electrodes on its surface, disposing a resin sheet containing a light conversion material so as to face the surface of the board and filling a space between the resin sheet and the board with a first light transmissive resin, covering a surface of the resin sheet opposite to a surface of the resin sheet covered with the first light transmissive resin, with a second light transmissive resin, forming a groove extending from a top surface of the second light transmissive resin to the board, filling the groove with light reflective resin and covering the top surface of the second light transmissive resin with the light reflective resin, removing the light reflective resin, and dicing the light emitting device by cutting along the light reflective resin.
Public/Granted literature
- US20190355887A1 METHOD FOR MANUFACTURING AN OPTICAL MODULE AND OPTICAL MODULE Public/Granted day:2019-11-21
Information query
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