Invention Grant
- Patent Title: Dual function magnetic tunnel junction pillar encapsulation
-
Application No.: US16586777Application Date: 2019-09-27
-
Publication No.: US10971675B2Publication Date: 2021-04-06
- Inventor: Son V. Nguyen , Alexander Reznicek , Donald F. Canaperi
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Otterstedt, Wallace & Kammer, LLP
- Agent L. Jeffrey Kelly
- Main IPC: H01L43/02
- IPC: H01L43/02 ; H01L43/12 ; H01L43/08 ; H01L27/22

Abstract:
Magnetic tunnel junction pillars are encapsulated by an oxidized diffusion barrier layer. Oxygen within the encapsulating material is used to oxidize metallic residue outside the pillars, converting the residue to a non-conductive material such as a metal oxide or metal oxynitride. Selective deposition of manganese on the metal layers of the pillars can be followed by oxidation of the manganese to form a manganese oxide diffusion barrier. Alternatively, manganese deposition can be followed by deposition of silicon dioxide and subsequent annealing to form a manganese silicate diffusion barrier.
Public/Granted literature
- US20200028069A1 DUAL FUNCTION MAGNETIC TUNNEL JUNCTION PILLAR ENCAPSULATION Public/Granted day:2020-01-23
Information query
IPC分类: