Invention Grant
- Patent Title: Well thermalized microstrip formation for flexible cryogenic microwave lines in quantum applications
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Application No.: US16880478Application Date: 2020-05-21
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Publication No.: US10971790B2Publication Date: 2021-04-06
- Inventor: Salvatore B. Olivadese , Patryk Gumann , Jerry M. Chow
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Garg Law Firm, PLLC
- Agent Rakesh Garg; Keivan Razavi
- Main IPC: H01P3/08
- IPC: H01P3/08 ; H01P11/00 ; H01L23/66 ; H01L39/02 ; H01L39/24

Abstract:
A microstrip that is usable in a quantum application (q-microstrip) includes a ground plane, a polyimide film disposed over the ground plane at a first surface of the polyimide film, and a conductor formed on a second side of the polyimide film such that the first surface is substantially opposite to the second surface. A material of the conductor provides greater than a threshold thermal conductivity (TH) with a structure of a dilution fridge stage (stage).
Public/Granted literature
- US20200280116A1 WELL THERMALIZED MICROSTRIP FORMATION FOR FLEXIBLE CRYOGENIC MICROWAVE LINES IN QUANTUM APPLICATIONS Public/Granted day:2020-09-03
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