Invention Grant
- Patent Title: Wireless earphone
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Application No.: US16782031Application Date: 2020-02-04
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Publication No.: US10972824B1Publication Date: 2021-04-06
- Inventor: Yu-Kai Tseng
- Applicant: Merry Electronics (Shenzhen) Co., Ltd.
- Applicant Address: CN ShenZhen
- Assignee: Merry Electronics (Shenzhen) Co., Ltd.
- Current Assignee: Merry Electronics (Shenzhen) Co., Ltd.
- Current Assignee Address: CN ShenZhen
- Agency: JCIPRNET
- Priority: TW108140964 20191112
- Main IPC: H04R1/10
- IPC: H04R1/10

Abstract:
A wireless earphone including a top cover, a bottom cover, two rigid circuit boards, a flexible circuit board, and an antenna is provided. The bottom cover is connected to the top cover, and an inner chamber is formed between the top cover and the bottom cover. The two rigid circuit boards are disposed at intervals in the inner chamber. The flexible circuit board has a first connection part and a second connection part. Two ends of the first connection part are coupled to the two rigid circuit boards respectively. The second connection part is attached on at least one of the two rigid circuit boards. The antenna is coupled to a corresponding rigid circuit board to radiate a radio frequency signal. A coupling capacitor is formed at a parallel overlapping area between the second connection part and the rigid circuit board.
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