Invention Grant
- Patent Title: Spread weave induced skew minimization
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Application No.: US16529903Application Date: 2019-08-02
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Publication No.: US10973115B2Publication Date: 2021-04-06
- Inventor: Robert Bisson , Marko Antonic
- Applicant: Ciena Corporation
- Applicant Address: US MD Hanover
- Assignee: Ciena Corporation
- Current Assignee: Ciena Corporation
- Current Assignee Address: US MD Hanover
- Agency: Clements Bernard Walker
- Agent Lawrence A. Baratta, Jr.; Christopher L. Bernard
- Main IPC: G06F17/50
- IPC: G06F17/50 ; H05K1/02 ; H05K1/18 ; H05K1/11 ; H05K1/03 ; H05K3/00

Abstract:
A printed circuit board includes a spread weave of fibers having a first direction and a second direction with corresponding fibers spread more in the first direction than the second direction; and one or more pairs of traces on the spread weave of fibers, wherein the first direction has less differences in dielectric permittivity seen by each trace than the second direction, wherein the one or more pairs of traces are routed according to a routing design that includes one or more fixed regions on the spread weave of fibers, where routing of traces therein is restricted to linear, non-angled routed in the first direction.
Public/Granted literature
- US20200029424A1 Spread weave induced skew minimization Public/Granted day:2020-01-23
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