Invention Grant
- Patent Title: Information projecting method and apparatus and laser processing apparatus
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Application No.: US16635785Application Date: 2018-07-24
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Publication No.: US10974347B2Publication Date: 2021-04-13
- Inventor: Shuichi Saeki , Hidenori Komiya
- Applicant: AMADA HOLDINGS CO., LTD.
- Applicant Address: JP Kanagawa
- Assignee: AMADA HOLDINGS CO., LTD.
- Current Assignee: AMADA HOLDINGS CO., LTD.
- Current Assignee Address: JP Kanagawa
- Agency: Greenblum & Bernstein, P.L.C.
- Priority: JPJP2017-152150 20170807
- International Application: PCT/JP2018/027603 WO 20180724
- International Announcement: WO2019/031222 WO 20190214
- Main IPC: B23K26/38
- IPC: B23K26/38 ; B23K26/03 ; H04N9/31 ; B23K26/70 ; B23K37/04 ; B23K101/18

Abstract:
An information projecting method projects information concerning a cut piece onto the cut piece, which is cut and separated from a plate-like work and is on a placement table, or onto a position adjacent to the cut piece. To adjust to an aspect ratio of a projector, the method assigns a long side of the work to an X-axis direction of the aspect ratio and a short side of the work to a Y-axis direction of the aspect ratio, finds a positional relationship d between a top face of the work and the projector according to plate thickness information of the work on the placement table and positioned corresponding to the projector arranged at a predetermined Y-axis-direction position, and with a zoom ratio based on the found positional relationship, projects the information concerning the cut piece onto the cut piece or onto a position adjacent to the cut piece.
Public/Granted literature
- US20200376604A1 INFORMATION PROJECTING METHOD AND APPARATUS AND LASER PROCESSING APPARATUS Public/Granted day:2020-12-03
Information query
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