Invention Grant
- Patent Title: Rapid self-assembled small-sized block polymer material with low quenching temperature and the preparation and application thereof
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Application No.: US15614211Application Date: 2017-06-05
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Publication No.: US10975188B2Publication Date: 2021-04-13
- Inventor: Hai Deng , Xuemiao Li , Jie Li
- Applicant: FUDAN UNIVERSITY
- Applicant Address: CN Shanghai
- Assignee: FUDAN UNIVERSITY
- Current Assignee: FUDAN UNIVERSITY
- Current Assignee Address: CN Shanghai
- Agent Adam Warwick Bess; Matihew Rupert Kaser
- Priority: CN201710048239.X 20170120
- Main IPC: C08F293/00
- IPC: C08F293/00 ; C07C69/653 ; C08F297/02

Abstract:
The present invention relates to a rapid assembled small-sized block polymer material with low quenching temperature and the preparation and application thereof. In particular, the present invention discloses a block copolymer, and glass transition temperature of the block copolymer is less than 120° C. The present invention also discloses the preparation and application of the block copolymer. The block copolymer can achieve excellent phase separation and rapid patterning at a lower annealing temperature (e.g. 80° C.) and a shorter annealing time (e.g. 30 s), and a photolithographic pattern with a very high resolution (e.g. 5 nm half-pitch) can be further obtained by etching, which provides a new photolithographic mean for further extension of Moore's Law to achieve semiconductor photolithography with a resolution of less than 10 nm, or even 5 nm (half-pitch).
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