• Patent Title: Rapid self-assembled small-sized block polymer material with low quenching temperature and the preparation and application thereof
  • Application No.: US15614211
    Application Date: 2017-06-05
  • Publication No.: US10975188B2
    Publication Date: 2021-04-13
  • Inventor: Hai DengXuemiao LiJie Li
  • Applicant: FUDAN UNIVERSITY
  • Applicant Address: CN Shanghai
  • Assignee: FUDAN UNIVERSITY
  • Current Assignee: FUDAN UNIVERSITY
  • Current Assignee Address: CN Shanghai
  • Agent Adam Warwick Bess; Matihew Rupert Kaser
  • Priority: CN201710048239.X 20170120
  • Main IPC: C08F293/00
  • IPC: C08F293/00 C07C69/653 C08F297/02
Rapid self-assembled small-sized block polymer material with low quenching temperature and the preparation and application thereof
Abstract:
The present invention relates to a rapid assembled small-sized block polymer material with low quenching temperature and the preparation and application thereof. In particular, the present invention discloses a block copolymer, and glass transition temperature of the block copolymer is less than 120° C. The present invention also discloses the preparation and application of the block copolymer. The block copolymer can achieve excellent phase separation and rapid patterning at a lower annealing temperature (e.g. 80° C.) and a shorter annealing time (e.g. 30 s), and a photolithographic pattern with a very high resolution (e.g. 5 nm half-pitch) can be further obtained by etching, which provides a new photolithographic mean for further extension of Moore's Law to achieve semiconductor photolithography with a resolution of less than 10 nm, or even 5 nm (half-pitch).
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