Invention Grant
- Patent Title: Loop type heat pipe
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Application No.: US16168194Application Date: 2018-10-23
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Publication No.: US10976111B2Publication Date: 2021-04-13
- Inventor: Yoshihiro Machida
- Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.
- Applicant Address: JP Nagano
- Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
- Current Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
- Current Assignee Address: JP Nagano
- Agency: Rankin, Hill & Clark LLP
- Priority: JPJP2017-207937 20171027,JPJP2018-040520 20180307
- Main IPC: F28F7/00
- IPC: F28F7/00 ; F28D15/04 ; F28D15/02

Abstract:
A loop type heat pipe includes: an evaporator configured to vaporize a liquid working fluid; a condenser configured to condense the vaporized working fluid into the liquid working fluid; a vapor pipe provided between the evaporator and the condenser; and a liquid pipe provided between the evaporator and the condenser. Each of the vapor pipe and the liquid pipe includes: a lower-side metal layer; an intermediate metal layer that is disposed on the lower-side metal layer; an upper-side metal layer that is disposed on the intermediate metal layer; and a conduit that is formed by the lower-side metal layer, the intermediate metal layer, and the upper-side metal layer, and at least one of the upper-side metal layer and the lower-side metal layer warps outward in a first portion of the vapor pipe.
Public/Granted literature
- US20190128620A1 LOOP TYPE HEAT PIPE Public/Granted day:2019-05-02
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