Invention Grant
- Patent Title: Method for defect inspection of transparent substrate by integrating interference and wavefront recording to reconstruct defect complex images information
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Application No.: US15590706Application Date: 2017-05-09
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Publication No.: US10976152B2Publication Date: 2021-04-13
- Inventor: Chau-Jern Cheng , Chin-Yu Liu , Xin-Ji Lai
- Applicant: National Taiwan Normal University
- Applicant Address: TW Taipei
- Assignee: National Taiwan Normal University
- Current Assignee: National Taiwan Normal University
- Current Assignee Address: TW Taipei
- Agency: Muncy, Geissler, Olds and Lowe, P.C.
- Priority: TW106100291 20170105
- Main IPC: G01B9/02
- IPC: G01B9/02 ; G01B9/021 ; G03H1/04 ; G03H1/00

Abstract:
A method for defect inspection of a transparent substrate comprises (a) providing an optical system for performing a diffraction process of object wave passing through a transparent substrate, (b) interfering and wavefront recording for the diffracted object wave and a reference wave to reconstruct the defect complex images (including amplitude and phase) of the transparent substrate, (c) characteristics analyzing, features classifying and sieving for the defect complex images of the transparent substrate, and (d) creating defect complex images database based-on the defect complex images for comparison and detection of the defect complex images of the transparent substrate.
Public/Granted literature
- US20180188016A1 Method and Apparatus for Defect Inspection of Transparent Substrate Public/Granted day:2018-07-05
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