Invention Grant
- Patent Title: Method for detecting EUV pellicle rupture
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Application No.: US16540874Application Date: 2019-08-14
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Publication No.: US10976674B2Publication Date: 2021-04-13
- Inventor: Chih-Tsung Shih , Bo-Tsun Liu , Tsung Chuan Lee
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: McDermott Will & Emery LLP
- Main IPC: G03F7/20
- IPC: G03F7/20

Abstract:
An extreme ultraviolet (EUV) lithography system includes an extreme ultraviolet (EUV) radiation source to emit EUV radiation, a collector for collecting the EUV radiation and focusing the EUV radiation, a reticle stage for supporting a reticle including a pellicle for exposure to the EUV radiation, and at least one sensor configured to detect particles generated due to breakage of the pellicle.
Public/Granted literature
- US20200057383A1 METHOD FOR DETECTING EUV PELLICLE RUPTURE Public/Granted day:2020-02-20
Information query
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