- Patent Title: Nitride semiconductor substrate, semiconductor laminate, laminated structure, method for manufacturing nitride semiconductor substrate and method for manufacturing semiconductor laminate
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Application No.: US16223924Application Date: 2018-12-18
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Publication No.: US10978296B2Publication Date: 2021-04-13
- Inventor: Takehiro Yoshida , Hajime Fujikura , Masatomo Shibata , Fumimasa Horikiri
- Applicant: SCIOCS COMPANY LIMITED , SUMITOMO CHEMICAL COMPANY, LIMITED
- Applicant Address: JP Ibaraki; JP Tokyo
- Assignee: SCIOCS COMPANY LIMITED,SUMITOMO CHEMICAL COMPANY, LIMITED
- Current Assignee: SCIOCS COMPANY LIMITED,SUMITOMO CHEMICAL COMPANY, LIMITED
- Current Assignee Address: JP Ibaraki; JP Tokyo
- Agency: Pearne & Gordon LLP
- Priority: JPJP2017-247639 20171225
- Main IPC: H01L21/02
- IPC: H01L21/02 ; H01L29/32 ; H01L29/04 ; H01L21/78 ; H01L29/872 ; H01L29/20

Abstract:
To provide a technique of increasing a radius of curvature of (0001) plane, and narrowing an off-angle distribution, there is provided a nitride semiconductor substrate containing a group III nitride semiconductor crystal and having a main surface in which a nearest low index crystal plane is (0001) plane, wherein (0001) plane in one of a direction along axis and a direction along axis orthogonal to the axis, is curved in a concave spherical shape with respect to the main surface, and a radius of curvature of the (0001) plane in one of the direction along the axis and the direction along the axis orthogonal to the axis is different from a radius of curvature of at least a part of the (0001) plane in the other direction.
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