Invention Grant
- Patent Title: Package structure and method for fabricating the same
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Application No.: US16262421Application Date: 2019-01-30
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Publication No.: US10978403B2Publication Date: 2021-04-13
- Inventor: Liang-Cheng Wang , Shiau-Shi Lin
- Applicant: DELTA ELECTRONICS, INC.
- Applicant Address: TW Taoyuan
- Assignee: DELTA ELECTRONICS, INC.
- Current Assignee: DELTA ELECTRONICS, INC.
- Current Assignee Address: TW Taoyuan
- Agency: Hauptman Ham, LLP
- Main IPC: H01L23/538
- IPC: H01L23/538 ; H01L21/48 ; H01L21/56 ; H01L23/31 ; H01L23/00 ; H01L49/02
Abstract:
A package structure includes a substrate, a first capacitor, a System on Chip unit and a wiring layer. The first capacitor is provided on the substrate. The System on Chip unit is bonded with the first capacitor in a first dielectric layer. The wiring layer is configured to electrically couple the first capacitor and the System on Chip unit. The wiring layer is provided on the first dielectric layer through a second dielectric layer.
Public/Granted literature
- US20200243453A1 PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME Public/Granted day:2020-07-30
Information query
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