A semiconductor package includes a lower substrate, a connection substrate coupled to the lower substrate, the connection substrate having a lateral portion surrounding a cavity, and a first conductive pattern on a top surface of the lateral portion, a lower semiconductor chip on the lower substrate, the lower semiconductor chip being in the cavity of the connection substrate, and the lower semiconductor chip including a second conductive pattern on a top surface of the lower semiconductor chip, a bonding member connecting the first conductive pattern and the second conductive pattern to each other, and a top package on the first conductive pattern and the second conductive pattern.